Rugged Heat Manager subsystem(HM)
What is a Heat Manager subsystem (HM)?Heater Manager subsystem (HM) will pre-heat the system to above 5C before the system can power on.
With a system like the XR8000 that supports Radio Access Network (RAN), these Telco systems are deployed in remote locations where the systems need to operate in extended (-20C to 39 65C) or extreme (-20C to 55C) temperature ranges. As many of the hardware components (such as iDRAC, 40 CPU, DIMM, SSD, etc.) used in the system cannot operate below 0C, the system needs to be pre-heated to above 5C before the system can power on. The Heater Manager subsystem (HM) will pre-heat the system, and make sure all the heater zones (9 zones total) are above 5C. The HM will heat the system as needed such that the temperature of all zones will be above 5C.
Restrictions- Heater Manager subsystem (HM) is only supported in 2U XR8620t.
- Heater Manager subsystem (HM) heating from -20C to system start booting: 4 minutes
- The max power draw per 2U HM sled is about 750W during the preheat process
System | Zone | Heating Item | Heater pad location |
---|---|---|---|
Lower U | 1 | CPU | Top of CPU heatsink |
2 | DIMM | Back of PCB | |
3 | DIMM | Back of PCB | |
4 | Lower U PCIe Riser Slot3 | PCIe back of PCB | |
5 | PCH, BMC, CPLD, and LOM | Back of PCB | |
6 | Not Used | - | |
Upper U | 7 | ROR-N1 or M.2 NVMe A side | Under AL plate & beneath M.2 |
7 | ROR-N1 or M.2 NVMe B side | Under AL plate & beneath M.2 | |
8 | ROR-N1 RAID chip | Top of Raid Controller | |
9 | Upper U PCIE Riser Slot2 | On the back of PCIe Card | |
10 | Upper U PCIE Riser Slot1 | On back of Bracket |